Результаты научной деятельности
Frequency Characteristics of PCB with Modal Reservation before and after Failure Using TALGAT
Статья в сборнике трудов конференции
2022 IEEE 23rd International Conference of Young Professionals in Electron Devices and Materials (EDM)
2022
Опубликовано
6 месяцев назад
Measuring the Level of Radiated Emissions from PCBs with Modal Reservation before and after Failure
Статья в сборнике трудов конференции
2022 International Conference on Actual Problems of Electron Devices Engineering (APEDE)
2022
Опубликовано
6 месяцев назад
TEM-cell Measurements of the Radiated Emissions from PCBs with Modal Reservation before and after Failure
Статья в сборнике трудов конференции
2022 International Ural Conference on Electrical Power Engineering (UralCon)
2022
Опубликовано
6 месяцев назад
Measuring Frequency Characteristic of PCBs with Modal Reservation under Climatic Impact before and after Short Circuit Failure
Статья в сборнике трудов конференции
2022 Dynamics of Systems, Mechanisms and Machines (Dynamics)
2022
Опубликовано
6 месяцев назад
Measuring Frequency Characteristic of PCBs with Modal Reservation under Climatic Impact
Статья в сборнике трудов конференции
2022 IEEE International Multi-Conference on Engineering, Computer and Information Sciences (SIBIRCON)
2022
Опубликовано
6 месяцев назад
Measuring Frequency Characteristics of PCBs with Modal Reservation before and after Open Circuit Failure under Climatic Impact
Статья в сборнике трудов конференции
2022 International Siberian Conference on Control and Communications (SIBCON)
2022
Опубликовано
6 месяцев назад
Ensuring the Reliability and EMC by Modal Reservation: A Brief History and Recent Advances
Статья в журнале
Symmetry
2022
Опубликовано
6 месяцев назад
Attenuating Ultra-Short Pulses in Coplanar Waveguide Modal Filters
Статья в сборнике трудов конференции
2023 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM)
2023
Опубликовано
6 месяцев назад
Analyzing the Capacitance Coupling of Electrodes with a Solder Layer on the Transistor Footprint
Статья в сборнике трудов конференции
2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM)
2023
Опубликовано
6 месяцев назад